Design Tools

Board design has become more and more complex, due to the introduction of high-speed serial links (ex. SATA, PCIe, HYDRA), as well as the new generation of high-end processors (ex. Intel Xeon, Freescale PowerPC 8640D). Therefore, in 2008, CES made a major investment in new state-of-the-art design tools, to help hardware engineers rapidly develop quality designs.

Temperature Analysis

Thermal efficiency is a key element in most airborne or hostile environments. CES is equipped with the most modern equipment and methods for thermal management, from the simulation phase to the prototype test phase. The elements which are analyzed range from a single mezzanine board to a complex airborne computer.

Custom Mechanics

When thermal analysis shows the need for special demanding mechanical elements, such as frames and enclosures, CES is able to provide mechanical engineering services to resolve the issues quickly.

Environmental Testing

CES is equipped with the most modern in-house testing facilities and has access to special external test laboratories for a complete panel of environmental testing. Capabilities include (this list is non-exhaustive):

• Climate chambers
• Vibration testing
• Shock testing
• Lightning testing
• Emission testing
• EMI and EMC
• Coating analysis

CES has also developed a thorough knowledge of DO-160D and ABD0100 standards.