Overview

A bundled package consists of any combination of computing elements, acquisition interfaces, network and storage interfaces, all bundled together with the required hardware and software elements to allow the user to build their application on a stable assembled subsystem. The bundle product notion is more complex to design, produce and test, but offers the customer the unique advantage to receive a product, which is ready-to-go.

The Typical Way

The user receives:

• Hardware 1 from Vendor A (ex. carrier board)
• Software 1 from Vendor B (ex. BSP for the carrier board)
• Hardware 2 from Vendor C (ex. interface card)
• Software 2 from Vendor D (ex. driver for the interface card)

The CES Way

The user receives a fully assembled subsystem with all of the hardware and software elements tested and delivered together.

The subsystem can be immediately introduced to the customer system. Adding a new supported element to a CES bundle is a straight-forward process, since hardware specifications are matched to optimize the connection and the board BSPs have been designed to smoothly accommodate their integration.